Technical
Thermal Management for High Power and Densely Packed PCBs. The need to pack higher powered components closer together in smaller spaces, means higher watt densities – this translates into increased heat which could impair the reliability and functionality of an electronic system.
With this problem in mind, Thermagon Inc. have introduced a thermally conductive, electrically insulating pre-preg system called ‘T-preg’. The T-preg dielectric has made possible the use of metal-based materials as heat spreaders.
T-Preg Performance Properties
| Thermal Conductivity | 3 W/m° C |
| Dielectric strength | 800 V/mil |
| Dielectric constant | 4.2 @ 1Khz |
| Lap shear AL/AL psi | 1400 |
| Peel strength Cu foil | 6 pli min |
| Water absorbweight % | 0.10* |
| Hardness, Shore D | 76 |
| Flexural strength | 50 |
| Elongation % | 0.51 |
| Copper weight avail | 0.5 - 6oz |
| Continuous use temp | 130°C |
| Intermittent use temp | 250°C |
| Shelf life °C/months | 20/6 |
| Colour | Green |
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*After 168 hours |
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Aluminium Substrates for Heat Management
Aluminium - Most common because of its excellent conductivity, light weight and lower cost.
Copper Core Substrates for Thermal Management and EMC Protection
Copper - Used for its very high thermal conductivity and complete compatibility with existing printed circuit board chemistry.
Metal Base-Plate Properties
| Base-plate Material | Thermal Expansion Coefficient ppm/C | Thermal Conductivity Z axis Watts/metre C | Thermal Resistance 1.6 Thk c-in 2/watt |
| Aluminium | 24 | 173 | 0.0143 |
| Copper | 18 | 260 | 0.0095 |
| Copper invar copper | 5 | 50 | 0.05 |